• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic device comprising a main support plate (2) provided with an integrated network of electronic connections (5), from one face to the other, a first electronic chip (6) mounted above the main support plate and connected to the network of electronic connections of the main support plate, a secondary support plate (10) comprising a platform (11) extending above the first chip and a base (14) projecting backwards relative to the platform and extending laterally to the first chip so as to present a rear end face (19) facing the main plate, and a second electronic chip (15) mounted above the platform, the secondary support plate (10) being provided with an integrated network of electronic connections (18), connected to the second chip and to the network of electronic connections (5) of the main support plate (2).
    公开号:FR3080218A1
    申请号:FR1853152
    申请日:2018-04-11
    公开日:2019-10-18
    发明作者:Jean-Michel Riviere
    申请人:STMicroelectronics Grenoble 2 SAS；
    IPC主号:
    专利说明:

    Electronic device comprising electronic chips
    The present invention relates to the field of microelectronics and more particularly the field of electronic devices including electronic chips.
    According to one embodiment, an electronic device is proposed which comprises: a main support plate having a rear face and a front face and provided with an integrated network of electronic connections, from one face to the other; a first electronic chip mounted above the front face of the main support plate and connected to the network of electronic connections of the main support plate; a secondary support plate comprising a platform extending above the first chip and having a rear face and a front face and comprising a base projecting rearwardly from the platform and extending laterally to the first chip towards the main support plate so as to have a rear end face opposite the front face of the main plate; and a second electronic chip mounted above a front face of the platform.
    Advantageously, the secondary support plate is provided with an integrated network of electronic connections comprising at least one front stud on the front face of the platform, connected to the second chip, and at least one rear stud on the rear end face. of said base, connected to the network of electronic connections of the main support plate.
    Thus, a compact electronic device can be obtained, in which the second chip is connected directly to the network of electrical connections of the main support plate via the network of electrical connections of the secondary support plate.
    The platform of the secondary support plate can extend away from the first chip.
    A support spacer can be interposed between the first chip and the platform of the secondary support plate.
    The secondary support plate may include a support base projecting rearwardly relative to the platform and bearing above the first chip and / or the main support plate.
    The front face of the first chip can be provided with at least one light sensor.
    The front face of the second chip can be provided with at least one light sensor.
    The device may include a third electronic chip mounted above the front face of the main support plate, a front face of this third chip being provided with a light emitter.
    According to an alternative embodiment, the device may include a cover mounted on the main support plate and delimiting a chamber in which the secondary support plate and the second chip are located.
    According to another alternative embodiment, the device may comprise a cover mounted above the main support plate and having an internal partition delimiting two chambers, the secondary support plate and the second chip being located in one of the chambers and the first chip passing through said interior partition.
    A front wall of said cover may have at least one opening provided with an optical element allowing light to pass through.
    An electronic device will now be described by way of nonlimiting example of embodiment, illustrated by the drawing in which: FIG. 1 represents a longitudinal section of the electronic device;
    2 shows a top view of the electronic device, according to II-II identified in Figure 1, the cover being in section;
    3 shows a cross section of the electronic device, according to III-ΠΙ identified in Figure 1;
    FIG. 4 represents a perspective view of a secondary support plate for the electronic device; and Figure 5 shows a longitudinal section of an alternative embodiment of the electronic device.
    An electronic device 1, illustrated in FIGS. 1 to 4, comprises a main support plate 2 made of a dielectric material, for example with a rectangular outline, which has a rear face 3 and a front face 4 and which is provided with a network. integrated 5 of electrical connections, from one face to the other, provided with rear studs and front studs.
    The electronic device 1 comprises a first electronic chip 6, for example with rectangular outline, which has a rear face 7 and a front face 8 and which is mounted above the front face 4 of the main support plate 2, by l 'through a layer of adhesive interposed between the front face 4 of the main support plate 2 and the rear face 7 of the first chip 6.
    The first chip 6 is connected to the network of electrical connections 5 by electrical connection wires 8a connecting the front pads of the first chip 6 to the front pads of the main support plate 2. According to an alternative embodiment, the first chip 6 could be connected to the network of electrical connections 5 by electrical connection elements between studs on the front face 4 of the main support plate 2 and studs on the rear face 16 of the first chip 6.
    The electronic device 1 comprises a secondary support plate 10, made of a dielectric material, which comprises a platform 11 situated above and at a distance from the first chip 6 and which has a rear face 12 and a front face 13. The platform 11 , for example with a rectangular outline, extends partly above and at a distance from the first chip 6 and partly laterally beyond the first chip 6.
    The secondary support plate 10 comprises a base 14 which extends projecting relative to the rear face 12 of the platform 11, laterally to the first chip 6 and in the direction of the front face 8 of the main support plate 2.
    The electronic device 1 comprises a second electronic chip 15 which has a rear face 16 and a front face 17 and which is mounted above the front face 13 of the platform 11, by means of a layer of adhesive interposed between the front face 13 of the platform 11 and the rear face 16 of the second chip 15.
    The secondary support plate 10 is provided with an integrated network 18 of electrical connections which includes rear studs of the rear end face 19 of the base 14, opposite the front face 8 of the main support plate 2, and front studs of the front face of the platform 11. For this, the integrated network of electrical connections 18 comprises for example integrated tracks of the platform 11 and integrated vias of the base 14.
    The second chip 15 is connected to the network of electrical connections 18 by electrical connection wires 20 connecting the front pads of the second chip 15 to the front pads of the platform 11. According to an alternative embodiment, the second chip 13 could be connected to the network of electrical connections 18 by electrical connection elements between the pads of the front face 13 of the platform 11 and the pads of the rear face 16 of the second chip 13.
    Rear studs of the rear end face 19 of the base are connected to front studs of the network of electrical connections 5 of the main support plate 2 by local point electrical junctions 21 formed by points of a conductive adhesive of the electricity or solder points.
    Thus, the second chip 15 is directly connected to the network of electrical connections 5 of the main support plate 2 via the network of electrical connections 18 of the secondary support plate 10. Thus, any electrical losses are reduced.
    The local point electrical junctions 21 make it possible to fix the secondary support plate 10 above the main support plate 2. However, dielectric adhesive can also be interposed between the front face 8 of the main support plate 2 and the rear face 19 of the base 14 of the secondary support plate 10.
    The electronic device 1 also comprises a support spacer 22, for example in the form of a local plate, located between the main support plate 2 and the platform 11 of the secondary support plate 10, with the interposition of an adhesive. fixing between them.
    The secondary support plate 10 can be manufactured in the following manner.
    There is a one-piece initial plate having parallel opposite faces, the thickness of which corresponds to the distance between the front face 13 of the platform 11 and the rear face 19 of the base 14. This initial plate is provided with a network of electrical connections. 18.
    A local reduction in the thickness of this initial plate is carried out by machining so as to obtain the platform 11 and to leave the base 14. Naturally, the part removed from the initial plate does not include any part of the network of electrical connections 18 .
    According to an exemplary embodiment, the electronic device 1 comprises the following arrangements.
    It is considered a longitudinal direction and a transverse direction.
    The first chip 6 comprises two light sensors 23 and 24 spaced apart longitudinally.
    The platform 11 remotely covers, at least in part, the part of the chip 6 presenting the light sensor 22 and does not cover the part of the chip 6 presenting the light sensor 23.
    The second chip 13 has, on its front face 17, a light sensor 25.
    The electronic device 1 also comprises a third electronic chip 26 which has a rear face 27 and a front face 28 and which is mounted on the front face 8 of the main support plate
    2, on the side and at a distance from the part of the first chip 6 presenting the light sensor 23.
    The third chip 26 has on its front face 28 a light emitter 30 and is connected to the network of electrical connections 5 of the main support plate 2, for example by a junction between a rear stud of the rear face 27 of the third chip 26 and a front stud of the main support plate 2 and by an electric wire 31 connecting a front stud of the third chip 26 and a front stud of the main support plate 2. According to an alternative embodiment, the third chip 26 could be connected to the network of electrical connections 5 by electrical connection elements between studs on the front face 4 of the main support plate 2 and studs on the rear face 27 of the third chip 26.
    Advantageously, the light sensors 23 and 24 and the light emitter are aligned longitudinally and the light sensor 25 of the second chip 15 is located approximately above the light sensor 23 of the first chip 6.
    According to a particular arrangement, the support spacer 22 covers the light sensor 23 of the first chip 6 and is made of a transparent material. The adhesive between the first chip 6 and the support spacer 22 is transparent.
    The base 14 comprises two feet 32 and 33 spaced transversely, located on the side of the third chip 26 relative to the first chip 6 and on either side of the third chip 26.
    On the side of the third chip 26, the platform 11 of the secondary support plate 10 has a notch 34.
    The electronic device 1 comprises a cover 35 which comprises a front or front wall 36 and a peripheral wall 37 which extends rearwards from the front wall 36 and which has a rear end face 38 situated above a peripheral zone of the front face 8 of the main support plate 2.
    The cover 35 is fixed to the main support plate 2 by means of a bead of adhesive 39 interposed between the front face 8 of the main support plate 2 and the rear end face 38 of the peripheral wall 37.
    The cover 35 includes a transverse internal partition 40 which projects in rearward projection from the front wall 36 and joins the longitudinal sides of the peripheral wall 37.
    The interior partition 40 has a rear notch 41 crossed by the first chip 6 and delimits two chambers 42 and 43 above the main support plate 2, so that the light sensor 23 of the first chip 6, the secondary support plate 10, the second chip 15, the support spacer 22 and the third chip 26 are located in the chamber 42 and that the light sensor 24 of the first chip 6 is located in the chamber 43.
    A bead of glue 44 is interposed between the interior partition 40 and the first chip 6, in the notch 41, and between the interior partition 40 and the main support plate 2, on either side of the first chip 6.
    The front wall 36 of the cover 35 has through openings 45 and 46 which are located opposite the chambers 42 and 43 and which are provided with optical elements 47 and 48 which can be traversed by the light, for example in the form of plates. The optical elements 47 and 48 can be supported on the internal shoulders of the openings 45 and 46 and bonded to the front wall 36 of the cover 35.
    The rear face of the optical element 47 is provided with an opaque layer 49 provided with an opening 50 situated above the light emitter 30 of the third chip 26 and with an opening 51 situated above the second chip light 15.
    The optical element 48 is located above the light sensor 25 of the first chip 6.
    According to an alternative embodiment, the optical element 47 could be replaced by two optical elements mounted in specific through openings of the front wall 36, located opposite the light emitter 30 and the light sensor 25.
    The electronic device 1 can operate in the following manner.
    The light emitter 30 of the third chip 26 emits light radiation, for example infrared, towards the outside through the opening 50 of the opaque layer 49 and of the optical element 47. Due to the existence from the notch 34 of the secondary support plate 10, the light emitted can directly reach the optical element 47. The light radiation emitted, present in the chamber 42, is picked up by the light sensor 23 of the first chip 6.
    The light sensor 24 of the first chip 6 captures the external light radiation through the optical element 48.
    The light sensor 25 of the second chip 15 captures the external light radiation through the optical element 47 and the opening 51 of the opaque layer 49. The second chip 15 can be made insensitive to the radiation emitted by the third chip 26 by means of filtering or by sequencing the operation of the light sensor 25 and the light emitter 30.
    The electronic device 1 can constitute a means of detecting the proximity of a body by processing the signals from the light sensors 23, 24 and 25.
    Thanks to the various arrangements described, the electronic device 1 is particularly compact.
    According to an alternative embodiment illustrated in FIG. 5, the support spacer 22 is omitted and the platform 11 of the secondary support plate 10 comprises a support base 52 projecting rearwards relative to the platform 11 and in support above the first chip 6 and / or the main support plate 2. The base is located longitudinally opposite the base 14, on the side of the interior partition 40.
    The support base 52 may comprise at least one foot fixed above the front face 8 of the first chip 6 by a bead of glue and / or at least one foot extending laterally to the first chip 6 and fixed to- above the front face 4 of the main support plate 2 by a bead of glue.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    1. Electronic device comprising a main support plate (2) having a rear face and a front face and provided with an integrated network of electronic connections (5), from one face to the other, a first electronic chip (6 ) mounted above the front face of the main support plate and connected to the network of electronic connections of the main support plate, a secondary support plate (10) comprising a platform (11) extending above the first chip and having a rear face and a front face and comprising a base (14) projecting rearward relative to the platform and extending laterally to the first chip in the direction of the main support plate so as to having a rear end face (19) facing the front face of the main plate, and a second electronic chip (15) mounted above a front face of the platform, the second plate support area (10) being provided with an integrated network of electronic connections (18) comprising at least one front stud on the front face of the platform, connected to the second chip, and at least one rear stud on the rear face d end (19) of said base (14), connected to the network of electronic connections (5) of the main support plate (2).
    [2" id="c-fr-0002]
    2. Device according to claim 1, wherein the platform (11) of the secondary support plate (10) extends away from the first chip (6).
    [3" id="c-fr-0003]
    3. Device according to one of claims 1 and 2, comprising a support spacer (22) interposed between the first chip (6) and the platform (11) of the secondary support plate (10).
    [4" id="c-fr-0004]
    4. Device according to one of claims 1 and 2, wherein the secondary support plate (10) comprises a support base (52) projecting rearwardly relative to the platform (11) and bearing au- above the first chip (6) and / or the main support plate (2).
    [5" id="c-fr-0005]
    5. Device according to any one of the preceding claims, in which the front face of the first chip (6) is provided with at least one light sensor (23, 24).
    [6" id="c-fr-0006]
    6. Device according to any one of the preceding claims, in which the front face of the second chip (15) is provided with at least one light sensor (25).
    [7" id="c-fr-0007]
    7. Device according to any one of the preceding claims, comprising a third electronic chip (26) mounted above the front face of the main support plate (2) and a front face of which is provided with a light emitter (30).
    [8" id="c-fr-0008]
    8. Device according to any one of the preceding claims, comprising a cover (35) mounted on the main support plate (2) and delimiting a chamber (42) in which the secondary support plate (10) and the second are located. bullet (15).
    [9" id="c-fr-0009]
    9. Device according to any one of claims 1 to 7, comprising a cover mounted above the main support plate (2) and having an internal partition (46) delimiting two chambers (42, 43), the secondary plate support (10) and the second chip (15) being located in one of the chambers and the first chip (6) passing through said interior partition (46).
    [10" id="c-fr-0010]
    10. Device according to one of claims 8 and 9, wherein a front wall of said cover has at least one opening (45, 46) provided with an optical element (47, 48) allowing light to pass through.
    类似技术:
    公开号 | 公开日 | 专利标题
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    FR3055509A1|2018-03-02|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD
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    JP4377072B2|2009-12-02|3D measurement module
    JP2005164286A|2005-06-23|Photodetector and spectroscope using the same
    FR3084479A1|2020-01-31|ELECTRONIC DEVICE AND ASSEMBLY, INCLUDING OPTICAL WAVEGUIDES
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    FR2800912A1|2001-05-11|OPTICAL SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING SUCH HOUSING
    同族专利:
    公开号 | 公开日
    FR3080218B1|2022-02-11|
    US20190319160A1|2019-10-17|
    US10903388B2|2021-01-26|
    CN210156372U|2020-03-17|
    CN110364518A|2019-10-22|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20140327129A1|2013-05-02|2014-11-06|Eunseok Cho|Package on package device and method of manufacturing the same|
    FR3012670A1|2013-10-30|2015-05-01|St Microelectronics Grenoble 2|ELECTRONIC SYSTEM COMPRISING STACKED ELECTRONIC DEVICES WITH INTEGRATED CIRCUIT CHIPS|
    FR3055509A1|2016-08-26|2018-03-02|Stmicroelectronics Sas|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD|
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    法律状态:
    2019-03-20| PLFP| Fee payment|Year of fee payment: 2 |
    2019-10-18| PLSC| Publication of the preliminary search report|Effective date: 20191018 |
    2020-03-19| PLFP| Fee payment|Year of fee payment: 3 |
    2021-03-23| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1853152|2018-04-11|
    FR1853152A|FR3080218B1|2018-04-11|2018-04-11|ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS|FR1853152A| FR3080218B1|2018-04-11|2018-04-11|ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS|
    US16/377,379| US10903388B2|2018-04-11|2019-04-08|Electronic device comprising electronic chips|
    CN201920480360.4U| CN210156372U|2018-04-11|2019-04-10|Electronic device comprising an electronic chip|
    CN201910286268.9A| CN110364518A|2018-04-11|2019-04-10|Electronic equipment including electronic chip|
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